US Patent 7916480 Busbar assembly with integrated cooling

A busbar assembly is configured such that the power devices (e.g., IGBT die) and diodes are directly mounted to the busbars. The busbars act as heat sinks, and may be cooled using micro channels, micropin fins, direct cooling, or any other heat transfer method. One assembly includes a plurality of busbars, a plurality of power semiconductor devices bonded to the plurality of busbars, and an integrated cooling system within one or more of the busbars.