Patent attributes
A semiconductor device and a manufacturing method thereof that can prevent mutual diffusion of impurity in a silicide layer and can decrease sheet resistance of an N-type polymetal gate electrode and a P-type polymetal gate electrode, respectively in the semiconductor device having gate electrodes of a polymetal gate structure and a dual gate structure are provided. The P-type polymetal gate electrode includes a P-type silicon layer containing P-type impurity, a silicide layer formed on the P-type silicon layer and having a plurality of silicide grains which are discontinuously disposed in a direction substantially parallel with the surface of the semiconductor substrate, a silicon film continuously formed on the surface of the P-type silicon layer exposed on the discontinuous part of the silicide layer and on the surface of the silicide layer, a second metal nitride layer formed on the silicon film, and a metal layer formed on the metal nitride layer.
