US Patent 7919854 Semiconductor module with two cooling surfaces and method
Patent 7919854 was granted and assigned to Infineon Technologies on April, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.
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US Patent 07919854 Semiconductor module with two cooling surfaces and method US Patent 7919854 Semiconductor module with two cooling surfaces and method
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Patent Number
0791985400
Patent Number
791985400
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079198540
Date of Patent
April 5, 2011
0Patent Application Number
121924960
Date Filed
August 15, 2008
0Official Website
Patent Primary Examiner
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079198540
Date of Patent
April 5, 2011
0Patent Application Number
121924960
Date Filed
August 15, 2008
0Official Website
Patent Primary Examiner
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US Patent 07919854 Semiconductor module with two cooling surfaces and method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07919854
Date of patent
April 5, 2011
Patent application number
12192496
Date Filed
August 15, 2008
Patent primary examiner
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