US Patent 7921903 Heat exchange system

A heat exchange system for electronic devices, preferably data processing devices which include high-performance processors or have a high processor density, includes essentially a primary cooling circuit and a secondary cooling circuit both being thermally associated to the one or more processor units. The secondary cooling circuit is configured as a completely closed system, the coolant in the secondary cooling circuit being driven exclusively by mechanical or inductive coupling with the flow drive of the primary cooling circuit.