Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 12, 2011
Patent Application Number
12639269
Date Filed
December 16, 2009
Patent Primary Examiner
Patent abstract
A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.
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