US Patent 7922887 Metal structure and method of its production
Patent 7922887 was granted and assigned to Hitachi on April, 2011 by the United States Patent and Trademark Office.
All edits
The present invention provides a method for producing a metal structure comprising a substrate and a metal film formed on the substrate; comprising the steps of providing surface having irregularities made of a electrical conductor in the area of the substrate where the metal body or film is to be formed; and preferentially forming the metal body or film by electroplating in the area provided with the conductive surface having irregularities. The plating bath may preferably contain an additive compound such as a cyanine dye which is capable of suppressing the plating reaction, and which loses such plating-suppressing effect with the progress of the plating reaction. The metal film can be produced by electroplating in the area provided with the surface having irregularities.
US Patent 07922887 Metal structure and method of its production US Patent 7922887 Metal structure and method of its production
US Patent 07922887 Metal structure and method of its production
Find more entities like US Patent 7922887 Metal structure and method of its production
