Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Eun-Chul Ahn0
Hae-Jung Yu0
Nam-Seog Kim0
Tae-Gyeong Chung0
Date of Patent
April 12, 2011
0Patent Application Number
124589230
Date Filed
July 28, 2009
0Patent Primary Examiner
Patent abstract
A method of fabricating an electronic device having stacked chips is provided. The method includes forming a plurality of chips arranged in a row direction and at least one chip arranged in a column direction. A molding layer is formed between the chips. Grooves are formed in the molding layer between the chips arranged in the row direction. Conductive interconnections are formed on the substrate having the grooves. The substrate is sawn along an odd- or even-numbered one of the grooves to be separated into a plurality of unit substrates. At least one of the separated unit substrates is folded along an unsawn groove of the grooves.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
