Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Zongrong Liu0
Terrence Caskey0
Weiping Pan0
Yong Du0
DeAnn Eileen Melcher0
Grant Villavicencio0
Lawrence Douglas Andrews, Jr.0
Reynaldo Co0
...
Date of Patent
April 12, 2011
0Patent Application Number
121425890
Date Filed
June 19, 2008
0Patent Primary Examiner
Patent abstract
An electrically insulative conformal coating is applied at least to the active (front) side and one or more sidewalls of the die during wafer processing. Also, a die has an electrically insulative conformal coating applied to at least the active (front) side and sidewalls. Also, assemblies include a stack of such die, electrically interconnected die-to-die; and assemblies include such a die or a stack of such die, electrically interconnected to underlying circuitry (for example in a substrate or a circuit board).
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