Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chang-Mou Huang0
Chiu-Mao Huang0
Date of Patent
April 12, 2011
0Patent Application Number
124642870
Date Filed
May 12, 2009
0Patent Primary Examiner
Patent abstract
A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe assembly are disposed in the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact with the first copper heat absorption component. The first heat pipe assembly serves to quickly transfer heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat.
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