Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shingo Higuchi0
Hiroshi Okumura0
Date of Patent
April 19, 2011
Patent Application Number
12339218
Date Filed
December 19, 2008
Patent Primary Examiner
Patent abstract
A semiconductor device includes a semiconductor substrate; a sealing resin layer formed on a top face of the semiconductor substrate; a metal post formed on the top face of the semiconductor substrate such that a top face of the metal post is exposed through the sealing resin layer; a projecting electrode formed on the top face of the metal post; and a low-elasticity resin layer made of a resin material with an elasticity modulus lower than that of the sealing resin layer and formed on the top face of the sealing resin layer such that part of the low-elasticity resin layer lies between the projecting electrode and the sealing resin layer.
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