Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Masahiro Lee0
Date of Patent
April 26, 2011
0Patent Application Number
129173040
Date Filed
November 1, 2010
0Patent Primary Examiner
Patent abstract
A film adhesion device includes a table carrying a semiconductor wafer, a pressing member (pressing roller) which presses a film (photoresist film) onto a surface side of the semiconductor wafer placed on the table, a bumper member provided on an outer peripheral side of the table and including a contact surface which is contacted by the pressing member when the pressing member presses the film, and an elevating support mechanism which supports the bumper member elevatably and positions the bumper member at a predetermined height level.
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