Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Consuelo Tangpuz0
Erwin Victor R. Cruz0
Margie T. Rios0
Rajeev Joshi0
Date of Patent
April 26, 2011
0Patent Application Number
123579810
Date Filed
January 22, 2009
0Patent Primary Examiner
Patent abstract
A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed to the conductive region on the semiconductor die. The coated wire is cut, thereby leaving a conductive stud bump on the conductive region, where the conductive stud bump includes an inner conductive portion and an outer oxidation-resistant layer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
