Patent attributes
As adhesive applicator head for use on an assembly line apparatus dispenses adhesive in a non-contact manner to produce a wide band of adhesive on a moving substrate. The applicator head comprises an upper body secured to a lower body and at least one nozzle mounted therewithin. An adhesive manifold within the applicator head ensures a steady flow of adhesive to tips of the nozzles. An air manifold within the applicator head is in communication with opposed pin holes positioned alongside each nozzle and oriented so that high velocity air exits the pin holes and flows along a nozzle tip of the nozzle. The high velocity air encounters freshly dispensed adhesive at the nozzle tip and causes it to leave the tip in a back-forth manner to result in a scribble pattern on the substrate. The scribble pattern's width is well defined. It is determined primarily by side to side placement of the nozzles in the applicator head at about the adhesive band width desired.
