US Patent 7935170 Method for manufacturing copper-based nanoparticles
Patent 7935170 was granted and assigned to Samsung on May, 2011 by the United States Patent and Trademark Office.
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Patent abstract
The present invention relates to a method for manufacturing copper-based nanoparticles, in particular, to a method for manufacturing copper-based nanoparticles, wherein the method includes producing CuO nanoparticles by mixing CuO micropowder and alkylamine in a nonpolar solvent and heating the mixture at 60-300° C.; and producing copper-based nanoparticles by mixing a capping molecule and a reducing agent with the CuO nanoparticles and heating the mixture at 60-120° C.
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Patent Inventor Names
Byung-Ho Jun0
Jae-Woo Joung0
Joon-Rak Choi0
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US Patent 07935170 Method for manufacturing copper-based nanoparticles US Patent 7935170 Method for manufacturing copper-based nanoparticles
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Patent Number
079351700
Patent Number
79351700
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079351700
Date of Patent
May 3, 2011
0Patent Application Number
119871620
Date Filed
November 28, 2007
0Official Website
Patent Primary Examiner
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US Patent 07935170 Method for manufacturing copper-based nanoparticles
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07935170
Date of patent
May 3, 2011
Patent application number
11987162
Date Filed
November 28, 2007
Patent primary examiner
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