Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 3, 2011
Patent Application Number
11628138
Date Filed
June 13, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
To provide a sputtering apparatus and method, and a sputtering control program which are configured simply and can secure the uniformity of the film thickness from the beginning to the end of the use of a target.
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