US Patent 7937908 Dual hot melt adhesive systems

The present disclosure relates to the use of first and second adhesives for the attachment of zipper flanges to reclosable packages. A first adhesive is typically a reactive, cross-linkable hot melt adhesive while the second adhesive is typically non-cross-linkable hot melt adhesive, typically, but not limited to, either EVA-based or polyamide-based. Alternatively, the second adhesive can be a coextrusion layer including a resin that is typically used as a sealant layer in zipper extrusion, such as metallocene type linear low density polyethylene.