Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sung Jun Kim0
Young Sik Ryu0
Date of Patent
May 10, 2011
0Patent Application Number
126483680
Date Filed
December 29, 2009
0Patent Primary Examiner
Patent abstract
The present invention provides a resin composition comprising a thermoplastic resin (A), an inorganic compound having a volume resistance of less than about 10−3 Ω·m and relative permeability of more than about 5,000 (B) and fiber filler (C). The resin composition of the present invention can have high impact strength and high electrical conductivity, and high electromagnetic interference (EMI) and radio frequency interference (RFI) shielding properties. The resin composition of the present invention can accordingly have multiple functions and can be used for electrical/electronic devices.
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