Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
May 10, 2011
Patent Application Number
12386594
Date Filed
April 21, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
New hardmask compositions comprising non-polymeric, metal-containing nanoparticles dispersed or dissolved in a solvent system and methods of using those compositions as hardmask layers in microelectronic structures are provided. The compositions are photosensitive and capable of being rendered developer soluble upon exposure to radiation. The inventive hardmask layer is patterned simultaneously with the photoresist layer and provides plasma etch resistance for subsequent pattern transfer.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
