Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 10, 2011
Patent Application Number
11667538
Date Filed
November 10, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A laser processing method is provided, which, when cutting an object to be processed comprising a substrate and a multilayer part, formed on a front face of the substrate, including a functional device, can cut the multilayer part with a high precision in particular.
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