Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Do Hyung Kim0
Suk Jin Kang0
Date of Patent
May 10, 2011
Patent Application Number
12438069
Date Filed
July 4, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention relates to an LED package including a lead frame including a chip attaching portion with at least one LED chip attached thereto and a plurality of terminal portions each having a width narrower than the chip attaching portion, and a housing for supporting the lead frame. The plurality of terminal portions include at least one first terminal portion extending from a portion of a width of the chip attaching portion, and a plurality of second terminal portions spaced apart from the chip attaching portion.
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