US Patent 7943423 Reconfigured wafer alignment
Patent 7943423 was granted and assigned to Infineon Technologies on May, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A method of manufacturing semiconductor device comprises placing multiple chips onto a carrier. An encapsulation material is applied to the multiple chips and the carrier for forming an encapsulation workpiece. The encapsulation workpiece having a first main face facing the carrier and a second main face opposite to the first main face. Further, marking elements are applied to the encapsulation workpiece relative to the multiple chips, the marking elements being detectable on the first main face and on the second main face.
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Patent Inventor Names
Daniel Porwol0
Edward Fuergut0
Jens Pohl0
Markus Brunnbauer0
Peter Strobel0
Thorsten Meyer0
Ulrich Wachter0
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US Patent 07943423 Reconfigured wafer alignment US Patent 7943423 Reconfigured wafer alignment
Infobox
Patent Number
07943423
Patent Number
7943423
Edits on 7 Dec, 2021
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US Patent 07943423 Reconfigured wafer alignment
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07943423
Date of patent
May 17, 2011
Patent application number
12401111
Date Filed
March 10, 2009
Patent primary examiner
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