US Patent 7943489 Bonded wafer assembly system and method
Patent 7943489 was granted and assigned to Texas Instruments on May, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.
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Patent Inventor Names
Braden Peter D'Andrea0
Daryl Ross Koehl0
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US Patent 07943489 Bonded wafer assembly system and method US Patent 7943489 Bonded wafer assembly system and method
Infobox
Patent Number
079434890
Patent Number
79434890
Edits on 22 Apr, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079434890
Date of Patent
May 17, 2011
0Patent Application Number
122380380
Date Filed
September 25, 2008
0Patent Primary Examiner
Edits on 7 Dec, 2021
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US Patent 07943489 Bonded wafer assembly system and method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07943489
Date of patent
May 17, 2011
Patent application number
12238038
Date Filed
September 25, 2008
Patent primary examiner
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