Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chi-Chung Lo0
Chi-Chen Cheng0
Date of Patent
May 17, 2011
0Patent Application Number
114254420
Date Filed
June 21, 2006
0Patent Primary Examiner
Patent abstract
A flexible printed circuit (FPC) and electronic component assembly. The FPC comprises a first protective layer having a first opening, a main layer on the first protective layer, and a second protective layer having a second opening exposing the main layer. The heat produced from the electronic component can be transmitted to the main layer by a heat-conductive medium between the electronic component and the main layer, and can be diffused via the first opening.
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