US Patent 7944032 Integrated circuit package with molded insulation
Patent 7944032 was granted and assigned to National Semiconductor on May, 2011 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 11, 2009
0
Date of Patent
May 17, 2011
0
Patent Application Number
12558431
0
Patent Inventor Names
Jaime A. Bayan
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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