Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 17, 2011
Patent Application Number
12068786
Date Filed
February 12, 2008
Patent Primary Examiner
Patent abstract
A semiconductor device includes an outer resin case having a peripheral wall and terminal mounting holes formed in the peripheral wall, and a layer assembly provided in the outer resin case. The layer assembly includes a semiconductor chip, an insulating circuit board on which the semiconductor chip is mounted, and a heat-dissipating metal base. External terminals having leg portions are arranged in mounting holes of the peripheral wall, and are press-fitted into the terminal-mounting holes. Bonding wires connect the terminal leg portions and a conductive pattern of the insulating circuit board or the semiconductor chip.
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