Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Toyosei Takahashi0
Date of Patent
May 24, 2011
Patent Application Number
12224097
Date Filed
February 27, 2006
Patent Primary Examiner
Patent abstract
An adhesive film used for bonding a semiconductor component or a liquid crystal display component with a substrate, the adhesive film being composed of a resin composition containing a curable resin and a filler, and the adhesive film showing a water vapor transmission rate of 30 [g/m2·24 h] or above, wherein the curable resin preferably contains photo-curable resin, thermosetting resin, or curable resin cured both by light and heat. The filler preferably contains a porous filler, the filler preferably has a mean void diameter of 0.1 to 5 nm, and the adhesive film preferably shows a water vapor transmission rate at 25° C. of 4 [g/m2·24 h] or above.
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