Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Youngcheol Kim0
Gwang Kim0
Koo Hong Lee0
Myung Kil Lee0
Date of Patent
May 24, 2011
Patent Application Number
11163558
Date Filed
October 22, 2005
Patent Primary Examiner
Patent abstract
A thin package system with external terminals and a leadframe is provided. An external bond finger defining template is provided and used to form external bond fingers on the leadframe. A die is provided and attached to the leadframe. At least portions of the die and the external bond fingers are encapsulated, and the leadframe is removed.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
