US Patent 7947594 Interconnection structure with low dielectric constant
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Patent abstract
A method for producing an interconnection structure including at least one insulating layer having a low dielectric constant and at least one metal connection element coated with a support layer and capable of connecting to at least one conductive area of a microelectronic device. The interconnection structure has an improved low dielectric constant. The interconnection structures may be a metal interconnection structure in a variety of integrated circuits.
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Patent Inventor Names
Didier Louis0
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US Patent 07947594 Interconnection structure with low dielectric constant US Patent 7947594 Interconnection structure with low dielectric constant
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Patent Number
079475940
Patent Number
79475940
Edits on 27 Sep, 2022
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Patent Jurisdiction
Patent Number
079475940
Date of Patent
May 24, 2011
0Patent Application Number
105719360
Date Filed
September 15, 2004
0Patent Primary Examiner
Edits on 7 Dec, 2021
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US Patent 07947594 Interconnection structure with low dielectric constant
Infobox
Is a
Patent jurisdiction
Patent number
07947594
Date of patent
May 24, 2011
Patent application number
10571936
Date Filed
September 15, 2004
Patent primary examiner
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