Patent attributes
A heat dissipation module includes a cooling base, at least a guide heat pipe and a cooling fin set. The cooling base provides at least a circular recess and at least a receiving groove. The guide heat pipe is placed in the circular recess. The cooling fin set is joined to the cooling base and provides a lower folding side at each cooling fin thereof and the folding side has at least a concave upward portion corresponding to the circular recess. The receiving groove is disposed at two end sides of the circular recess for receiving solder, soldering paste, solder club or bonding agent. Therefore, when the cooling fin set and the guide heat pipe are joined to the cooling base, the receiving groove is capable of speeding up the joint and preventing abnormal phenomena such as incomplete soldering, creating clearance and excessive solder.
