Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Willam J. Reeder0
Patrick W. Tandy0
Stephen F. Moxham0
Steven G. Thummel0
Brad D. Rumsey0
Dana A. Stoddard0
Joseph C. Young0
Date of Patent
May 31, 2011
0Patent Application Number
104210790
Date Filed
April 23, 2003
0Patent Primary Examiner
Patent abstract
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
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