Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Eiji Hayashi0
Date of Patent
May 31, 2011
0Patent Application Number
128177420
Date Filed
June 17, 2010
0Patent Primary Examiner
Patent abstract
Regarding a semiconductor device, especially the present invention suppresses disconnection of the connection structure concerned in the semiconductor device which has the electric and mechanical connection structure using solder, and aims at improving connection reliability. And to achieve the above objects, the semiconductor device has the solder bump which electrically connects a semiconductor chip and a package substrate, the under-filling resin with which it filled up between the semiconductor chip and the package substrate, and a solder ball which electrically connects a package substrate with the outside, and the solder bump's elastic modulus is made lower than the elastic modulus of a solder ball.
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