Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kei Miyoshi0
Naoki Yamakawa0
Tomoyuki Goto0
Date of Patent
May 31, 2011
0Patent Application Number
114471000
Date Filed
June 6, 2006
0Patent Primary Examiner
Patent abstract
A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23° C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.
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