US Patent 7952178 Package for an integrated circuit
Patent 7952178 was granted and assigned to Texas Instruments on May, 2011 by the United States Patent and Trademark Office.
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According to various illustrative embodiments of the present invention, a device for an integrated circuit includes a monolithic frame having a plurality of alignment features disposed thereon, the monolithic frame having a mounting surface disposed thereon for the integrated circuit, the monolithic frame also having a thermal interface area disposed thereon for the integrated circuit. The device also includes an electrical interface capable of providing an electrical connection for the integrated circuit, the plurality of alignment features being substantially independent of the electrical interface, and an adhesive layer disposed between the monolithic frame and the electrical interface.
US Patent 07952178 Package for an integrated circuit US Patent 7952178 Package for an integrated circuit
US Patent 07952178 Package for an integrated circuit
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