Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chang-Feng Wan0
Date of Patent
May 31, 2011
Patent Application Number
11113545
Date Filed
April 25, 2005
Patent Primary Examiner
Patent abstract
An embodiment of the present invention provides a method of manufacturing hermetic packaging for devices on a substrate wafer, comprising forming a plurality of adhesive rings on a cap wafer or the substrate wafer, bonding the cap wafer to the substrate wafer with an adhesive layer, forming trenches in the cap wafer and the adhesive rings along outer rim of the adhesive rings, and covering sidewall of the trenches by at least one deposited film to provide a diffusion barrier to moisture or gas.
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