Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
May 31, 2011
Patent Application Number
10608718
Date Filed
June 27, 2003
Patent Primary Examiner
Patent abstract
A method and apparatus for fabrication of microelectronic devices are shown. In an embodiment of the invention, a microelectronic device comprises a die, the die comprising a first side, a second side, and an edge; a first plate, the first plate coupled with the die; and a package, the die being coupled with the package.
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