Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 7, 2011
Patent Application Number
12067280
Date Filed
October 5, 2006
Patent Primary Examiner
Patent abstract
A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.
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