Patent attributes
A light emitting diode package including a substrate; a plurality of electrodes on the substrate; a light emitting diode on the substrate; at least one wire connecting the light emitting diode and at least a first electrode of the plurality of electrodes; a reflecting member formed around the light emitting diode and being spaced apart from the light emitting diode; a cavity included in the reflecting member; a mold material including in the cavity; and a heat sink disposed under the light emitting diode and configured to emit heat generated by the light emitting diode. Further, a connection portion connecting the plurality of electrodes extends under a surface of the substrate through a portion of the substrate, and an inside surface of the reflecting member has a step-shape structure.
