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US Patent 7960827 Thermal via heat spreader package and method
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Patent
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Date Filed
April 9, 2009
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Date of Patent
June 14, 2011
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Patent Application Number
12421118
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Patent Citations Received
US Patent 12009343 Stackable package and method
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US Patent 11700692 Stackable via package and method
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US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof
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US Patent 11972999 Unlanded thermal dissipation pillar adjacent active contact
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Patent Inventor Names
August J. Miller, Jr.
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Christopher M. Scanlan
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Jeffrey A. Miks
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Mahmoud Dreiza
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
7960827
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Patent Primary Examiner
Roy K Potter
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