Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 21, 2011
Patent Application Number
12212667
Date Filed
September 18, 2008
Patent Primary Examiner
Patent abstract
This application relates to a method of manufacturing a semiconductor device comprising: providing a metal carrier; placing the metal carrier into a mold for forming a molded structure holding the metal carrier; segmenting the metal carrier into at least two disconnected metal carrier segments; and attaching a semiconductor chip to the molded structure.
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