Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 21, 2011
Patent Application Number
12582940
Date Filed
October 21, 2009
Patent Primary Examiner
Patent abstract
A semiconductor chip packaging on a flexible substrate is disclosed. The chip and the flexible substrate are provided with corresponding raised and indented micron-scale contact pads with the indented contact pads partially filled with a liquid amalgam. After low temperature amalgam curing, the chip and the substrate form a flexible substrate IC packaging with high conductivity, controllable interface layer thickness, micron-scale contact density and low process temperature. Adhesion between the chip and the substrate can be further enhanced by coating other areas with non-conducting adhesive.
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