US Patent 7967184 Padless substrate for surface mounted components
Patent 7967184 was granted and assigned to SanDisk on June, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.
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US Patent 07967184 Padless substrate for surface mounted components US Patent 7967184 Padless substrate for surface mounted components
Infobox
Patent Number
0796718400
Patent Number
796718400
Edits on 22 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079671840
Date of Patent
June 28, 2011
0Patent Application Number
112804190
Date Filed
November 16, 2005
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079671840
Date of Patent
June 28, 2011
0Patent Application Number
112804190
Date Filed
November 16, 2005
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07967184 Padless substrate for surface mounted components
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07967184
Date of patent
June 28, 2011
Patent application number
11280419
Date Filed
November 16, 2005
Patent primary examiner
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