Patent 7968012 was granted and assigned to Laird (company) on June, 2011 by the United States Patent and Trademark Office.
Disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment. In one embodiment, the shield may include an electrically nonconductive substrate, such as a thermoformable film, coated with an electrically conductive element, such as an extensible ink or a combination of conductive fibers with an extensible film. In one embodiment, a compressible conductive perimeter gap gasket may be formed by using a form in place process.