US Patent 7968962 Semiconductor fabrication method and system
Patent 7968962 was granted and assigned to Micron Technology on June, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor device is disclosed. In one embodiment, a device includes a substrate having one or more vias and a carrier coupled to the substrate to form a sealed cavity between the carrier and the substrate. In some embodiments, the sealed cavity may be pressurized. The device may also include a redistribution layer formed over the one or more vias on a side of the substrate. Other devices, systems, and methods are also disclosed.
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Patent Inventor Names
Swarnal Borthakur0
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US Patent 07968962 Semiconductor fabrication method and system US Patent 7968962 Semiconductor fabrication method and system
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Patent Number
07968962
Patent Number
7968962
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US Patent 07968962 Semiconductor fabrication method and system
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Is a
Current assignee
Patent jurisdiction
Patent number
07968962
Date of patent
June 28, 2011
Patent application number
12848786
Date Filed
August 2, 2010
Patent primary examiner
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