Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
YoungChul Kim0
Byoung Wook Jang0
Jae Hak Yee0
Junwoo Myung0
Date of Patent
June 28, 2011
0Patent Application Number
121019150
Date Filed
April 11, 2008
0Patent Primary Examiner
Patent abstract
An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.
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