US Patent 7968990 Semiconductor device and method of fabricating the same
Patent 7968990 was granted and assigned to Spansion on June, 2011 by the United States Patent and Trademark Office.
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Edits on 28 Nov, 2023
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Patent abstract
A method of fabricating a semiconductor device includes: mounting a semiconductor chip on a substrate; forming an upper connection terminal on a side of the substrate on which the semiconductor chip is mounted; forming a resin seal portion that seals the semiconductor chip and the upper connection terminal so that an upper surface of the upper connection terminal is exposed; and shaping the upper connection terminal so that the upper surface of the upper connection terminal becomes lower than an upper surface of the resin seal portion.
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US Patent 07968990 Semiconductor device and method of fabricating the same US Patent 7968990 Semiconductor device and method of fabricating the same
Infobox
Patent Number
0796899000
Patent Number
796899000
Edits on 6 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079689900
Date of Patent
June 28, 2011
0Patent Application Number
116547040
Date Filed
January 17, 2007
0Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079689900
Date of Patent
June 28, 2011
0Patent Application Number
116547040
Date Filed
January 17, 2007
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07968990 Semiconductor device and method of fabricating the same
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07968990
Date of patent
June 28, 2011
Patent application number
11654704
Date Filed
January 17, 2007
Patent primary examiner
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