US Patent 7968991 Stacked package module and board having exposed ends
Patent 7968991 was granted and assigned to Unimicron Technology on June, 2011 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 25, 2007
0
Date of Patent
June 28, 2011
0
Patent Application Number
11976488
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Patent Inventor Names
Lin-Yin Wong
0
Mao-Hua Yeh
0
Wang-Hsiang Tsai
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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