US Patent 7969019 Module with stacked semiconductor devices

Semiconductor device 1 includes: first wiring board 5 provided with a plurality of external terminals 9 on the under surface thereof; first semiconductor chip 3 with the under surface thereof mounted on the upper surface of first wiring board 5; and second semiconductor chip 10 with the under surface thereof mounted on the upper surface of first semiconductor chip 3. On the upper surface of first wiring board 5, connecting pad 6a and connecting pad 6b are provided, while connecting pad 6a is electrically connected with the under surface of first semiconductor chip 3 and connecting pad 6b is arranged closely to an end portion of first semiconductor chip 3. Connecting pad 6a and connecting pad 6b are electrically connected with external terminals 9. Semiconductor device 1 further includes: connecting pad 6c provided as contacting or as being close to an upper end portion of second semiconductor chip 10 while being electrically connected with the upper surface of second semiconductor chip 10, and wire 12 which electrically connects connecting pad 6b and connecting pad 6c.