Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yukinobu Mikado0
Masakazu Aoyama0
Michimasa Takahashi0
Takenobu Nakamura0
Date of Patent
July 5, 2011
0Patent Application Number
127132490
Date Filed
February 26, 2010
0Patent Primary Examiner
Patent abstract
A multilayer printed wiring board including insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.
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