Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tung Lok Li0
Date of Patent
July 5, 2011
Patent Application Number
12511077
Date Filed
July 29, 2009
Patent Primary Examiner
Patent abstract
A semiconductor including a selectively plated lead frame is disclosed. The lead frame contains a die pad and a plurality of lead fingers, where each lead finger is formed with a bonding pad on the center portion of the lead finger by selective plating. The surface area of the lead finger material is increased so the adhesion to molding material is improved. The edges of the lead finger tips are half etched to further increase the surface area of lead finger material. A method of manufacturing the lead frame is also provided.
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