US Patent 7973719 Semiconductor package and semiconductor device
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Patent abstract
A semiconductor package includes an insulating substrate configured to be provided for mounting a semiconductor chip which processes a signal with a frequency in a radio frequency band. The insulating substrate includes a first external connecting electrode, a second external connecting electrode, and a partial antenna wiring. The first external connecting electrode and the second external connecting electrode are connected with the partial antenna wiring. Each of the first external connecting electrode and the second external connecting electrode is an electrode to be connected with an external antenna pattern.
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Patent Citations Received
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Patent Inventor Names
Hatsuhide Igarashi0
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US Patent 07973719 Semiconductor package and semiconductor device US Patent 7973719 Semiconductor package and semiconductor device
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Patent Number
07973719
Patent Number
7973719
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US Patent 07973719 Semiconductor package and semiconductor device
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Is a
Patent jurisdiction
Patent number
07973719
Date of patent
July 5, 2011
Patent application number
12289682
Date Filed
October 31, 2008
Patent primary examiner
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